Summary
Overview
Work History
Education
Skills
EXPERIENCE
Accomplishments
Timeline
Generic

Vasantha Kumar Kandaswamy

Chennai

Summary

As Mechanical Product Engineer / Mechanical Systems engineer with 16+ years of SEMI experience, seeking a Position to leverage my knowledge and experience into a reputed company, to enhance my skills as well organization growth.

Overview

4
4
years of professional experience

Work History

Product Engineer / NPI Engineer

KLA+ (knows As KLA Tencor)
05.2022 - Current


Product Line – Wafer Handling Handlers (EFEM) FFC 300 & 200mm / 300,200,150mm wafer (All kinds of handlers)


Aug 2023 to Present @ India


  • Responsible for providing assistance and support to the Customer Service Engineers in diagnosing, fixing and debugging sophisticated optical/electro-mechanical equipment, computer systems coupled with sophisticated software solutions.
  • Be the lead/owner and provide solutions to field raised issues where the Customer Service Engineer has been unable to resolve these issues in the systems at customers’ sites
  • Develop, test and validate detailed requirement specifications and solutions using systems engineering
  • Hands-on troubleshooting and maintenance of engineering prototype systems
  • Leading cross functional teams of ME, EE & SW
  • Self-managing priorities and activities to support the new product development and Escalation support
  • Travel to customer site to address Escalation
  • Conduct Internal and External training/DEMO for CSE /IE/TSE and New Joiners.
  • Field escalation handling by sharing POA’ s, On call and Onsite
  • Semiconductor Ro bots and Electro - mechanical motion system handling
  • Expertise in handling & troubleshooting Semiconductor Equipment Front End Mo dule (EFEM) / Handler/ Wafer inspection tools and SEMI conductor Ro bots within clean room standards


Product Line – Wafer Surface Inspection Tool / FFC 300/200mm Wafer handlers / FFC Wafer handling Inspection tool


May 2022 to July 2023 @ Singapore


  • Working / Worked on KLA Wafer surface defect inspection tools (Micro, Macro & Altair)
  • Working / Worked on KLA all different kinds of wafer handlers and wafers like 150mm/200mm/300mm, FFC wafers and Special Wafers
  • Handling Cro ss function team s, ME, EE, SW, Manufacturing, CSE team and Procurement team etc.
  • Conducting Service Reediness Review by different PLC Phase
  • New Pro duct FRU identification, release in global Stock
  • Test and handling Tooling’s, Tools in global FAB’s
  • Creating Procedure / WBT (Web Based Training) documents for new pro duct or new upgrade initiations
  • Successfully created Documents, WBT, enabled parts, Train CSE/IE/TSE for new program on FFC 300mm/200mm to LGD South Korea, Sony Japan & Intel Portland etc.,
  • Successfully Traveled to Onsite & given OJT (On Job Trainning) at FAB Sony Japan and Intel Portland for new program on FFC 300mm/200mm
  • AR / VR converting, Converting WBT or Technical Procedures into AR / VR
  • Conduct Internal and External training/DEMO for CSE /IE/TSE and New Joiners.
  • Field escalation handling by sharing POA’ s, On call and Onsite
  • Field support to Customer Service Engineer thro ug h on call and onsite support.
  • Semiconductor Ro bots and Electro - mechanical motion system handling
  • BOM, Documentation, procedure & BKM creation based on SEMI standards for Integration, Upgrade, Test process & New pro duct development

Mechanical Systems Engineer / Sr. Technical Lead

HCL Technologies (Contract With KLA+**)
08.2019 - 03.2022

Nov 2007 to Mar 2022 in multiple location


Product Line – Wafer Surface Inspection Tool / Wafer Stress measurement Tool / All Different kinds of Wafer Handlers


2020 to March 2022 @ HCL- KLA ODC, INDIA Chennai, TN (2+ years)


  • Working/ Worked as Mechanical System Engineer, Team Lead, Design Engineer, for multiple projects (SP1 S GP, Ennovia 20X USA, OMD ISR & CP HK)
  • Mechanical Systems Engineer, Alternate Ro bot evaluation for KLA SP1 MFG team
  • Team Lead, New Ennovia20X document creation for KLA US Enno via team (Voice assist video creation)
  • Design Engineer, Design and Detailing for KLA Israel, A800 etc.
  • Design Engineer, Design, Det ailing, e- Procurement, MSR creation for KLA Ho n Ko ng, CP tools.
  • Travel to KLA SGP Engg for Alternate Ro bot identification and Evaluation.
  • Lead HCL Mechanical Team for different projects
  • Conduct Internal training for HCL-KLA new joiners
  • BOM, Documentation, & procedure creation for Integration, Upgrade, Test process
  • Vendor follow, Parts Manual & Bill of Materials, creation
  • Worked in CA D packages SolidWorks, Pro - e & AutoCAD
  • Worked and have Hands on experience in ECO release thro ugh Ennovia


2016 to 2020 @ KLA Head Quarters - USA, Milpitas, California (3+ Years)


  • Worked on Enhancing KLA legacy Wafer Film thickness measurement tools (F5x, UVxx)
  • Engineering Clean room tool s owner ship
  • Travel to FAB for Escalation support and Upgrade (N XP Netherlands)
  • Handling Cro ss function team s, ME, EE, SW, Manufacturing, CSE team and Procurement team etc.
  • Conduct Internal and External training/DEMO for CSE and New Joiners .
  • Field support to Customer Service Engineer thro ug h on call and onsite support.
  • Semiconductor Ro bots and Electro- mechanical motion system handling
  • Expertise in handling & troubleshooting Semiconductor Equipment Front End Mo dule (EFEM) / Handler/ Wafer inspection tools and SEMI conductor Ro bots within clean room standards.
  • Preventative and repair maintenance on complex electro -mechanical semiconductor equipment’s
  • BOM, Documentation, procedure & BKM creation based on SEMI standards for Integration, Upgrade, Test process & New pro duct development
  • Vendors follow, Parts Manual & Bill of Materials, creation for New pro duct development
  • Worked in CA D packages SolidWorks, Pro - e & AutoCAD, to do small design change and Detailing
  • Worked and have Hands on experience in ECO package Ennovia


2013 to 2016 @ KLA Germany - Germany, Weilburg, Hassan (3+ Years)


  • Worked o n KLA Wafer surface defect inspection tools (Micro, Macro)
  • Engineering Clean room tool owner ship
  • Travel to FAB for Escalation support and Upgrade (US C China, U MC Taiwan & Bosch Germ any)
  • Handling Cro ss function team s, ME, EE, SW, Manufacturing, CSE team and Procurement team etc.
  • Conduct Internal and External training/DEMO for CSE, New Joiners.
  • Field support to Customer Service Engineer thro ug h on call and onsite support.
  • Semiconductor Ro bots and Electro - mechanical motion system handling
  • Expertise in handling & troubleshooting Semiconductor Equipment Front End Mo dule (EFEM) / Handler/ Wafer inspection tools and SEMI conductor Ro bots within Clean room standards.
  • Preventative and repair maintenance on complex electro -mechanical semiconductor equipment’s
  • BOM, Documentation, procedure & BKM creation based on SEMI standards for Integration, Upgrade, Test process & New pro duct development
  • Vendor follow, Parts Manual & Bill of Materials, creation for New pro duct development
  • Worked in CA D packages SolidWorks, Pro - e & AutoCAD, to do small design change and Detailing
  • Worked and have Hands o n experience in ECO package Ennovia


2009 to 2013 @ HCL- KLA India LAB- India, Chennai, TN (5+ Years)


  • Worked on KLA all different kinds of wafer handlers EFEM
  • Engineering LAB ownership in India
  • Support S W and ME team for New pro duct development, SQC testing
  • Travel to KLA worldwide facilities like Israel, Singapore, USA & Germany for proto build, Test and evaluation
  • Conduct Internal and External training for new joiners from HCL and KL A India facility.
  • Semiconductor Ro bots and Electro - mechanical motion system handling
  • Expertise in handling & troubleshooting all different kinds of wafer handlers
  • Preventative and repair maintenance on engineering LAB handlers
  • BOM, Documentation, procedure & BKM creation based on SEMI standards for Integration, Upgrade, Test process & New pro duct development
  • Worked in CA D packages SolidWorks, Pro - e & AutoCAD, to do small design change and Detailing
  • Worked and have Hands on experience in ECO package (Ennovia)


2007 to 2009 @ HCL India, Chennai, TN (2+Years)


Earlier couple of years with in HCL worked for couple of clients in Telecom / S mall SEMI Company as Design Engineer, as below responsibilities / accomplishments


  • SEMI conductor Gas Flow controller design.
  • Enclosure Design for Base station and Antenna pro ducts
  • Input gathering for new and existing pro ducts from onsite manager & customer,
  • Detail design & Det ail drawing using CAD tools
  • Local vendor finding for proto making
  • Proto model testing
  • ECO creation in PL M (Agile)

Technical Apprentice (Quality)

Addison & Co Ltd
08.2022 - 08.2023

Product Line – Cutting tools like, Drills, Taps, Center drills etc.


  • Field inspection on cutting tool pro duction plant,
  • Final pro duct and in progress product quality confirmation,
  • Maintaining quality systems documents,
  • Inspecting the pro ducts adhere to the ISO, BIN, JS standards etc.

Education

Master of Science - Quality Management

BITS Pilani, Rajasthan, India
Work Integrated Learning Programme (Online)
04.2025

Bachelor of Science - Mechanical Engineering

VIT University
Vellore, India
04.2007

Diploma in Mechanical Engineering - Mechanical Engineering

Sri Nallalaghu Nadar Polytechnic
Chennai, India
04.2002

Skills

Management:

  • Handling Cross functional teams (ME, EE, SW, GSS)
  • Vendor Support/Training
  • Vendor Follow-up
  • Customer support/Train
  • Tool DEMO Preparation
  • Field Support (On Call / Onsite)

Technical:

  • SRR by PLC Phase
  • FRR for field Install
  • Root Cause Analysis (8-D, 5-why, Fishbone)
  • FRU release
  • Doc/Procedure/WBT
  • BKM Creation
  • Tool Align/Calibration
  • Diff kinds of Wafer Handlers
  • Integration /Install/ Upgrade
  • Proto build/Evaluation
  • SEMI/Clean Room Standard
  • GD&T/BOM Creation
  • Detailing/Drafting
  • AR / VR Basic

Software:

  • Microsoft Office Tools
  • CAD pack, SolidWorks, Creo
  • ECO pack, Ennovia, Agile
  • AutoCAD

EXPERIENCE

KLA+ (knows as KLA Tencor) - Product Engineer / NPI Engineer

  • India (Aug 2023 – Present**)
  • Singapore (May 2022 – July 2023)


HCL Technologies (Contract with KLA+**) - Mechanical Systems Engineer / Sr. Technical Lead

  • Chennai, India (Aug 2019 - Mar 2022)
  • Milpitas, USA (Mar 2016 - Aug 2019)
  • Weilburg, Germany (Apr 2013 - Nov 2016)
  • Chennai, India (Oct 2007 - Apr 2013)


Addison & Co Ltd - Technical Apprentice (Quality)

  • Chennai, India (Aug 2002 - Aug 2003)

Accomplishments

Awards & Honors:

  • Best Technical Paper presentation for Engineers Day Celebration at HCL in 2008 -2009, Won 1st Price
  • Nominated for young talent at HCL 2008 -2009
  • Six Sig ma Green Belt (Value creation for Brooks Load Port)
  • Training Champion for Fresh Graduate’s

Timeline

Technical Apprentice (Quality)

Addison & Co Ltd
08.2022 - 08.2023

Product Engineer / NPI Engineer

KLA+ (knows As KLA Tencor)
05.2022 - Current

Mechanical Systems Engineer / Sr. Technical Lead

HCL Technologies (Contract With KLA+**)
08.2019 - 03.2022

Master of Science - Quality Management

BITS Pilani, Rajasthan, India

Bachelor of Science - Mechanical Engineering

VIT University

Diploma in Mechanical Engineering - Mechanical Engineering

Sri Nallalaghu Nadar Polytechnic
Vasantha Kumar Kandaswamy